HotChips_MCP_for_Wireless_Application_Intel.pdf

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1、HOTCHIPS 2022Heterogenous Integration Enables FPGA Based Hardware Acceleration for RF ApplicationsSergey ShumarayevAllen ChanTim HoangProgrammable Solution Group(PSG)CTO OfficeRobert KellerTexas InstrumentsIntel ConfidentialDepartment or Event Name2Outlines5G Use Cases and Massive MIMO Typical Base

2、StationMotivationDARPA CHIPS ProgramBuilding BlocksGrowing AIB-Based Chiplet PortfolioChiplet Connection with EMIB and AIBChiplet IntegrationAFE Chiplet Design FeaturesHeterogeneous Integration AdvantagesCHIPS Phase 2 Platform Hardware OverviewEnabling Massive MIMOEnabling Radar SystemEnabling Next

3、Generation SystemsConclusionIntel ConfidentialDepartment or Event Name35G Use Cases and Massive MIMO Base Station5G Use CasesDiagram of typical base station with massive MIMO channelsBandwidth/Power?JESD 204BBW308GbpsChannels26 12.5GbspPower25WLatency135 Frame ClkBoard ComplexityHighWorkload executi

4、on time?Intel ConfidentialDepartment or Event NameMotivation4Gordon E.MooreMoores Law paper“It may prove to be more economical to build large systems out of smaller functions,which are separately packaged and interconnected.”Intel ConfidentialDepartment or Event Name5DARPA CHIPS ProgramCHIPS program

5、 seeks to establish a new paradigm in IP reuse.The vision of CHIPS is an ecosystem of discrete modular,reusable IP blocks,which can be assembled into a system using existing and emerging integration technologies.Successful assembly of chiplets of various sizes into a heterogeneously integrated syste

6、m resulting in:Shorter design developmentLower-risk design integrationLower-cost design implementationSystem power reductionBoard area complexity reductionBoard design simplificationDARPA MTO,CHIPSIntel ConfidentialDepartment or Event Name6At https:/ Using chiplets from different process nodes and f