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SoIC与基于微凸点的3D封装对比
SoIC与基于微凸点的3D封装对比
行业数据
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电子行业报告·算力芯片系列:大算力时代的先进封装投资机遇-230403(56页).pdf
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相关数据
台积电混合键合(SoIC)性能优势
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行业数据
2026-06-09
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台积电SoIC供应能力细分(按年末)
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行业数据
2026-04-20
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图292016以来微球技术平台为重要业绩增长点
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行业数据
2025-04-21
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微凸点用于HBM及xPU的芯片间、Interposer电气连接
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行业数据
2025-04-01
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图292016以来微球技术平台为重要业绩增长点
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行业数据
2025-04-01
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移动端的AI芯片未来有望从InFO-PoP向SoIC发展
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行业数据
2025-01-15
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台积电SoIC平台及基于其的AMD3DV-Cache技术
fCDlsYLnuqcgfCDmj4/ov7AgfAp8IC0tLSB8IC0tLSB8Cnwg57uT5p6E56GFIHwgU3RydWN0dXJhbCBzaWxpY29uIHwKfCDnvJPlrZjoiq/niYcgfCA2NE1CIEwzIGNhY2hlIGRpZSB8Cnwg55u05o6l6ZOc5a+56ZOc6L+e5o6lIHwgRGlyZWN0IGNvcHBlci10by1jb3BwZXIgYm9uZCB8Cnwg56GF6YCa5a2U77yIVFNW77yJ55So5LqO56GF6Ze06YCa5L+hIHwgVGhyb3VnaCBTaWxpY29uIFZpYSAoVFNWKSBmb3Igc2lsaWNvbi10by1zaWxpY29uIGNvbW11bmljYXRpb24gfAp8IOacgOmrmDjmoLjlv4NaZW4gMyBDQ0QgfCBVcCB0byA4LWNvcmUgWmVuIDMgQ0NEIHwKCioq6LWE5paZ5p2l5rqQ77ya5YWs5Y+45a6Y572RKio=
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行业数据
2024-10-14
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2024年4月以来万得央企指数与万得微盘股指数走势(定基100点)
fCDml6XmnJ8gICAgICAgfCDkuIflvpflhahBIHwg5aSu5LyB5oyH5pWwIHwg5LiH5b6X5b6u55uY6IKh5oyH5pWwIHwKfC0tLS0tLS0tLS0tLXwtLS0tLS0tLS18LS0tLS0tLS0tLXwtLS0tLS0tLS0tLS0tLS0tfAp8IDIwMjQtMDQtMDEgfCAxMDAgICAgIHwgMTAwICAgICAgfCAxMDAgICAgICAgICAgICB8CnwgMjAyNC0wNC0wOCB8IDk4ICAgICAgfCAxMDIgICAgICB8IDk1ICAgICAgICAgICAgIHwKfCAyMDI0LTA0LTE1IHwgMTAxICAgICB8IDEwMyAgICAgIHwgOTAgICAgICAgICAgICAgfAp8IDIwMjQtMDQtMjIgfCA5OSAgICAgIHwgMTAyICAgICAgfCA4NSAgICAgICAgICAgICB8CnwgMjAyNC0wNC0yOSB8IDEwMSAgICAgfCAxMDMgICAgICB8IDkwICAgICAgICAgICAgIHwKfCAyMDI0LTA1LTA2IHwgMTAyICAgICB8IDEwNCAgICAgIHwgOTUgICAgICAgICAgICAgfAp8IDIwMjQtMDUtMTMgfCAxMDEgICAgIHwgMTAzICAgICAgfCA5MCAgICAgICAgICAgICB8CnwgMjAyNC0wNS0yMCB8IDEwMiAgICAgfCAxMDQgICAgICB8IDk1ICAgICAgICAgICAgIHwKfCAyMDI0LTA1LTI3IHwgMTAxICAgICB8IDEwMyAgICAgIHwgOTAgICAgICAgICAgICAgfAp8IDIwMjQtMDYtMDMgfCA5OSAgICAgIHwgMTAyICAgICAgfCA4NSAgICAgICAgICAgICB8CnwgMjAyNC0wNi0xMCB8IDk4ICAgICAgfCAxMDEgICAgICB8IDgwICAgICAgICAgICAgIHwKfCAyMDI0LTA2LTE3IHwgOTcgICAgICB8IDEwMCAgICAgIHwgODUgICAgICAgICAgICAgfAp8IDIwMjQtMDYtMjQgfCA5NiAgICAgIHwgOTkgICAgICAgfCA4MCAgICAgICAgICAgICB8CgrotYTmlpnmnaXmupDvvJpXaW5k77yM5Lit5rOw6K+B5Yi456CU56m25omA
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行业数据
2024-08-20
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微凸点技术与混合键合技术对比
fCDmioDmnK/mraXpqqQgfCDkvKDnu5/lh7jngrnmioDmnK8gfCDmt7flkIjplK7lkIjmioDmnK8gfAp8IC0tLSB8IC0tLSB8IC0tLSB8Cnwg6ZOc5p+xICsg54SK5o6lIHwgzrxCdW1wcyB8IOihrOWeqyArIOeUteS7i+i0qOihqOmdoiB8Cnwg6ZmE552A5ZKM5Zue5rWB54SKIHwgLSB8IOWupOa4qeS4i+WIneWni+mZhOedgCB8Cnwg5bqV6YOo5aGr6IO2IHwgLSB8IOmrmOa4qemAgOeBqyB8CgrotYTmlpnmnaXmupDvvJrlhazkvJflj7figJxTaVDkuI7lhYjov5vlsIHoo4XmioDmnK/igJ3vvIzljY7npo/or4HliLjnoJTnqbbmiYA=
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其它
2024-07-17
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SoIC与典型3DIC能耗及热阻对比
fCBDaGFyYWN0ZXJpc3RpYyB8IFR5cGljYWwgM0RJQyB8IFNvSUMgfAp8LS0tLS0tLS0tLS0tLS0tLXwtLS0tLS0tLS0tLS0tLXwtLS0tLS18CnwgRW5lcmd5L2JpdCBkYXRhIHwgMSAgICAgICAgICAgIHwgMC4wOVggfAp8IFRoZXJtYWwgUmVzaXN0YW5jZSB8IDEgICAgICAgICAgICB8IDAuNS0wLjhYIHwKCui1hOaWmeadpea6kO+8muS4nOWMl+ivgeWIuO+8jOOAilN5c3RlbSBvbiBJbnRlZ3JhdGVkIENoaXBzIChTb0lD4oSiKSBmb3IgM0QgSGV0ZXJvZ2VuZW91cyBJbnRlZ3JhdGlvbuOAiw==
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其它
2024-07-11
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SoIC与典型3DIC的RLC性能对比
fCBDaGFyYWN0ZXJpc3RpYyB8IFR5cGljYWwgM0RJQyB8IFNvSUMgfAp8LS0tLS0tLS0tLS0tLS0tLXwtLS0tLS0tLS0tLS0tLXwtLS0tLS18CnwgUmVzaXN0YW5jZSAgICAgfCAxICAgICAgICAgICAgfCAwLjA4eCB8CnwgSW5kdWN0YW5jZSAgICAgfCAxICAgICAgICAgICAgfCAwLjAxeCB8CnwgQ2FwYWNpdGFuY2UgICAgfCAxICAgICAgICAgICAgfCAwLjA4eCB8CgrotYTmlpnmnaXmupDvvJrkuJzljJfor4HliLjvvIzjgIpTeXN0ZW0gb24gSW50ZWdyYXRlZCBDaGlwcyAoU29JQ+KEoikgZm9y
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其它
2024-07-11
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SoIC与FC在低频时的插入损失对比
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其它
2024-07-11
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SoIC与典型3DIC键合间距/密度对比
fCBDaGFyYWN0ZXJpc3RpYyB8IFR5cGljYWwgM0RJQyB8IFNvSUMgfAp8LS0tLS0tLS0tLS0tLS0tLXwtLS0tLS0tLS0tLS0tLXwtLS0tLS18CnwgQnVtcC9ib25kIFBpdGNoIHwgNDAgzrxtICAgICAgICB8IDAuMjN4IHwKfCBCdW1wL2JvbmQgRGVuc2l0eSB8IDF4ICAgICAgICAgICB8IDE2eCAgfAoK6LWE5paZ5p2l5rqQ77ya5Lic5YyX6K+B5Yi477yM44CKU3lzdGVtIG9uIEludGVncmF0ZWQgQ2hpcHMgKFNvSUPihKIpIGZvciAzRCBIZXRlcm9nZW5lb3VzIEludGVncmF0aW9u44CL
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其它
2024-07-11
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不同凸点间距(BumpPitch)对应的技术(单位:um)
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其它
2024-07-10
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晶圆到晶圆(W2W)或芯片到晶圆(D2W),均通过删除凸点方式减薄厚度。其中W2W
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其它
2024-06-17
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以实现更好的性能、 更低的功耗和延迟以及更小的外形尺寸。WoW 适用于高良率节点和相同裸片尺寸的应用或设计,甚至支持与第 3 方晶圆的集成。
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电子行业报告·算力芯片系列:大算力时代的先进封装投资机遇-230403(56页).pdf
F,O以WL得P/F到OP独LP立工的艺流芯程片。RDLfirst则是先在载板上生成RDL,再将裸晶接合。
长电科技各工厂业绩
长电科技Chiplet封装工艺
通富微电晶圆级封装工艺类别
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