周铮-CPO 下的硅光子芯片设计与挑战.pdf

1、2025 ANSYS,Inc./Proprietary.Do Not Share.CPO 下的硅光子芯片设计与挑战下的硅光子芯片设计与挑战周铮2025 ANSYS,Inc./Proprietary.Do Not Share.CPO Challenges and Solutions2025ANSYS,Inc./Proprietary.Do Not Share.3 Traditional Cu interconnects cannot scale to current requirements Optical interconnects will continue to replace coppe

2、r Current optical interconnects provide increased scalability,but power/cost requirements become untenable Co-packaged optics brings power and cost down and allows for breaking through the“power wall”Why Co-Packaged Optics?Ref:Co-Packaged Optics and an Open Ecosystem-Cisco BlogsRef:Intel Labs Day 20

3、20Ref:“Perspective on the future of silicon photonics and electronics”N.Margalit,et.al.,Appl.Phys.Lett.118,220501(2021)2025 ANSYS,Inc./Proprietary.Do Not Share.4Industry Moving Towards CPO,key enabler of future AI/HPC systemsTSMCSamsungNVIDIA Announces Spectrum-X Photonics,Co-Packaged Optics Network

4、ing Switches to Scale AI Factories to Millions of GPUsCisco Demonstrates Co-packaged Optics(CPO)System at OFC 2023-Cisco BlogsIntel Demonstrates First Fully Integrated Optical I/O ChipletAyar Labs Unveils Worlds First UCIe Optical Chiplet for AI Scale-Up ArchitecturesOdin CPO 2.0 architecture-Ranovu

5、sBroadcom Advances Optical Connectivity for AI Infrastructure with Industry-Leading Solutions at OFC 2025 Samsung Showcases AI-Era Vision and Latest Foundry Technologies at SFF 2024|Samsung Semiconductor GlobalK.Zhang,Semiconductor Industry:Present&Future,2024 IEEE ISSCC,San Francisco,2024,pp.10-15,

6、https:/doi.org/10.1109/ISSCC49657.2024.10454358 2025 ANSYS,Inc./Proprietary.Do Not Share.5Significant Multiphysics Challenge with CPO EvolvingRef:“Perspective on the future of silicon photonics and electronics”N.Margalit,et.al.,Appl.Phys.Lett.118,220501(2021)Thermal and StressIncreased IR drops elec