DC25_SLIDES_Track07_NextGen224GbpsChipToChipMR_Wu.pdf

1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralNext Generation 224 Gbps-PAM4 Chip-to-Chip/MR SERDES,Package,Channels,and Link Simulation and AnalysisSpeaker:Hsinho WuAuthors:Hsinho Wu,Mike

2、Li,Masashi Shimanouchi,Itamar Levin,and Ariel Cohen Altera2Information Classification:GeneralImageSPEAKERSHsinho WuPrincipal Engineer,AlteraHDr.Hsinho Wu is a Principal Engineer at Altera Corporation.He presently works on high-speed communication systems IPs.His development and research interests in

3、clude signal integrity,clock and data recovery,equalizations,device and system modeling,simulation techniques,and software architecture.Dr.Wu was a recipient of the 2021 Intel Achievement Award.3Information Classification:General Introduction 200+Gbps C2C/MR Reference Package and Channel Characteris

4、tics OIF-CEI-224G-MR COM Analysis 224 Gbps C2C/MR Waveform-Domain Link Simulations Conclusions and Next StepsAgenda4Information Classification:GeneralIntroduction5Information Classification:General200+Gbps Chip-to-Chip/Medium Reach Links Up to 500 mm reach with up to 1 connectorTrending IL target fr

5、om IEEE 802.3dj and OIF-CEI-224G-MR TFs:bump-bump IL of 35 dB C2C/MR applicationsAttachment Unit Interface(AUI,Ethernet),Connecting host devices to sensors/antennas,data converter,accelerators,in telecom and AI/ML systemsBalancing between BER(pre-FEC COM DER of 5e-6 for OIF-CEI,6.7e-6 for Ethernet,p

6、ost-FEC BER 1e-15),latency(KP and LL-FEC),and power consumption From OIF-CEI 6.0 draft6Information Classification:GeneralC2C/MR Reference Package and Channel Characteristicsat212.5 Gbps and 224 Gbps 7Information Classification:GeneralIEEE 802.3dj and OIF-CEI-224G TFs have established two types of re