DC25_PAPER_Track04_TheInfluenceofCopperCrystal_shen_V2.pdf

1、 Information Classification:General The Influence of Copper Crystal Structure on Signal Integrity Chuansheng Cheng Bytedance Changdong Gu Zhejiang Huanergy Dayong Shen Bytedance Hui Luo Zhejiang Huanergy Lei Ding Zhejiang Huanergy Anbing Sun Ruijie networks Tony Liu Nan Ya New Materials tony.liuccl-

2、 Wenqiang Zhang Nan Ya New Materials zhangwqccl- Information Classification:General Abstract:The signal integrity of the conductor for high frequency and high-speed digital applications requires copper foils with lower profiles and without magnetic elements.In fact,copper foils must undergo several

3、manufacturing processes to the end products,for example,the lamination process and the various PCB manufacturing steps.As well as the copper foil profile and surface chemistry,some manufacturing processes,such as laminate etching,low profile browning process,etc.,may also influence the signal integr

4、ity performances of the end product.Particularly,the crystallographic orientations and grain boundaries of the copper foils would play important roles in manipulating surface morphologies in PCB etching,which further influences the signal integrity of the conductor in HDIs.However,there is few repor

5、ts on this issue.Herein,low profile copper foils with tunable crystallographic structures and surface morphologies were fabricated by the copper foil manufacturing industry and receieved the same and routine manufacturing processes in CCL and PCB sections.Thus,the impact of the microstructures of co

6、pper foil on the signal integrity was finally obtained by experimental investigations.Our findings would bring a novel contribution from the perspective of copper foils to get lower electrical losses in high-speed digital applications.Authors Biography Dayong Shen is a high-speed signal system engin