track2-AI浪潮下的高速互联技术-224G PCIe 与高速铜互联的协同创新-富浩-简志明.pdf

1、AI 浪潮下的高速互联技术:224G,PCIe 与高速銅互联的协同创新江苏富浩电子科技有限公司 研发总监 简志明 产业趋势 铜互连解决方案业界标准与发展趋势技术瓶颈与挑战 高速连接器的研发设计与制造信号完整性,设计,优化与制造数位转型:电子化平台生产与制造富浩:高速连接器产业趋势:Scale Up 与 Scale OutThe future of data centers is not scale-up or scale-out its scale-up with scale-out.数据中心的未来不是二选一，而是融合两者优势。Ethernet,UEC,Infiniband,UCIePCIe,

2、NVLink,UALink,CXL,UCIeCPC,NPC;Internal HS Copper.Backplane Conn.,Cable Tray,CDFPCPO related,HSIO,ELSFPSNIA Storage.AITMProject(协议层)Santa Clara,CA.,August 4,2025 SNIA,a not-for-profit global organization for technologies related to handling and optimizing data,todayannounced Storage.AI,an open standa

3、rds project for efficient data services related to AI workloads.Storage.AI will focus on industry-standard,non-proprietary,and neutral approaches to solving AI-related data problems to optimize the performance,efficiency,and cost-effectiveness of AI workloads.Ongoing SNIA TechnicalWorkEnablesSDXI(Sm

4、art DataAcceleration Interface)Vendor-neutral DMAacceleration across CPU,GPU,DPU;memory-to-memorycopies and transformsComputational Storage API&ArchitectureAllows SSDs and storage devicesto perform computation(e.g.filtering,inferencing,formatconversion)directlyNVM Programming ModelUnified software i

5、nterface foraccessing NVMe,SCM,andRDMA memory/storage tiersSwordfish/RedfishExtensionsUnified,Redfish-compatiblestorage management for hybridand disaggregated infrastructureObject Drive WorkgroupStandard interfaces for objectstorage devices to operate inRDMA/hyperscaleenvironmentsFlexible Data Place

6、mentAPIsWorks with computationalstorage and GPU-aware storagepipelines to optimize layout andstreaming throughput铜互连解决方案:业界标准与发展趋势铜互连解决方案:业界标准与发展趋势OIF,High Density(HD)Connector Project(物理层)OIF High-Density Connector Project 448Gbps Considerations,by Matt Traverso BW:12.8T/25.6T Pitch:0.5mm 64 Tx/Rx