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2020年5G基建半导体分析报告 -美国半导体协会(英文版)(32页).pdf

上传人: Me****y 编号:19683 2020-09-25 32页 8.11MB

1、 SIA CONFIDENTIAL | 5G INFRASTRUCTURE ANALYSIS | 1 5G WIRELESS INFRASTRUCTURE SEMICONDUCTOR ANALYSIS 2 | 5G INFRASTRUCTURE ANALYSIS 8 | 5G INFRASTRUCTURE ANALYSIS | SIA CONFIDENTIAL EXECUTIVE SUMMARY On behalf of SIA, a wireless market intelligence firm has analyzed all of the semiconductor function

2、 product families within the key elements of a 5G radio access network (RAN)- baseband unit (BBU) and active antenna unit (AAU)/remote radio unit (RRU) systems for 5G base stations along with the current domestic United States and foreign/international semiconductor suppliers. Our conclusion is that

3、 despite the United States maintaining overall market-share leadership in semiconductors with a 45% share of the global market, substitutes for U.S. components exist for nearly every semiconductor product family required to build a complete RAN infrastructure. In fact, our analysis indicates that of

4、 the more than fifty critical semiconductor elements necessary to design, manufacture, and sell a competitive 5G RAN network1, only 3 components could face supply constraints outside the United States in the event of an export restriction. For each of those three components, we have further conclude

5、d that alternatives are currently being deployed or under active development, especially within China by Huaweis semiconductor design arm, HiSilicon. 5G INFRASTRUCTURE ANALYSIS | 4 OUR CONCLUSION FOR THE BASEBAND UNIT SYSTEM FOR A 5G BASE STATION IS THAT THE TWO KEY SEMICONDUCTOR PRODUCT FAMILIES TH

6、AT MAY PRESENT SUPPLY ISSUES OUTSIDE OF THE UNITED STATES ARE: Commercial off-the-shelf Field Programmable Gate Arrays (FPGAs) 10Gbps Ethernet PHY Transceivers/Switches This is based upon current available information regarding foreign/ international semiconductor suppliers, their current products,

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根据报告的内容,本文主要分析了5G无线基础设施半导体分析。文章指出,尽管美国在半导体领域保持全球市场份额的领导地位,但在构建完整的5G无线接入网络(RAN)基础设施所需的半导体产品家族中,几乎每个产品都有可替代的方案。文章还指出,在5G基站中,可能面临供应问题的两个关键半导体产品家族是商业现成的现场可编程门阵列(FPGAs)和10Gbps以太网物理收发器/交换机。此外,文章还提到了一些非美国的半导体制造公司,如台湾的Advanced Wireless Semiconductor Company和法国的United Monolithic Semiconductors等。总的来说,文章认为,虽然可能存在一些供应瓶颈,但非美国的半导体设计将继续快速发展,并有望在不久的将来解决这些问题。
5G无线网络设备供应商有哪些? 5G网络与4G网络的主要区别是什么? 5G网络的三大技术特点是什么?
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