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Empowering Open EMEA.pdf

上传人: 2*** 编号:139976 2023-08-27 10页 1.34MB

1、Bijan Nowroozi CTOLesya Dymyd Future Technologies Symposium ChairOCP FoundationOCP AnnouncementsCreating an Open Chiplet Economy 32-and 24 Gb/s/lineAdvanced power managementHalf-width slicesSideband slices Bidirectional slices Redundancy(Lane repair)Extensibility Portability Scalability Low LatencyB

2、unch of Wires 2.0 SpecificationNew Link Layer Specification.Announcing Enterprise Edge Gateway!Hyperscale CloudRegional NetworksPremise(Enterprise)DeviceDC-MHSOpen EdgeFar EdgeMid EdgeNear EdgeOpen Enterprise Edge Gateway.Exciting open Hardware contribution Co-designed with Software contributions to

3、 OCPs SAI project that enable DENT or SONiC.Enterprise Edge GatewayOCP:Shaping The Future!Empowering OpenCreating synergies R&D and innovation communities Research,industry,startups Solving For Deep technical risk and new opportunities Acceleration to marketPresently Working OnAI Hardware-Software C

4、o-design Cloud Service Model Computational Storage Collaborate on long-term opportunities,shape the future!OCP Future Technologies2023 OCP Regional FTS,April 19,1pm-5pm AI/HPC and Sustainable Data Center Technology Demonstrations Spotlights promising future technologies and showcases results and FTI

5、 strategic outcomesOCP Community Embraces the FutureOCP has historically brought hyperscale innovations to the open Community.Startups rapidly develop innovative ideas and seek ways to bring them to the market.We have an announcement!OCP CommunityHyperscaleEcosystemIT EcosystemSeedScalingEmergingAnnouncement OCP Startup ProgramOCP Startup ProgramIntegrated CommunityStartupStartupStartupSeedScalingEmergingHyperscalersMore Information on our Startup Program Why we launched the OCP Startup ProgramLanding page/OCP Blog(?)-where to read more about the programEmpowering Ope

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Bijan Nowroozi和Lesya Dymyd主持了一场关于未来技术研讨会,讨论了OCP(开放计算项目)的多个议题。其中包括创建开放芯片经济,介绍32和24 Gb/s/line的高速传输,先进的电源管理,半宽切片,边带切片,双向切片,以及冗余(车道修复)等特性。此外,还介绍了新的“Bunch of Wires 2.0”规范和新的链路层规范,并宣布了企业边缘网关的推出。OCP正在与研发、创新社区、初创公司等合作,解决技术风险和市场加速等问题。他们还在进行AI硬件-软件协同设计、云服务模型和计算存储等长期合作项目。2023年4月19日,OCP将举办区域性未来技术研讨会,讨论AI/HPC和可持续数据中心等技术。OCP社区一直致力于将超大规模创新引入开放社区,帮助初创公司快速发展并将创新推向市场。OCP还宣布了新的初创公司计划,以支持从种子到 scaling再到 emerging阶段的初创公司。
"OCP基金会如何塑造未来技术?" "开放芯片经济是如何实现的?" "OCP初创企业计划有哪些优势?"
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