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安森美(onsemi):2023年IGBT技术和应用概述白皮书-如何以及何时使用IGBT(中译版)(12页).PDF

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1、 Semiconductor Components Industries,LLC,2017March,2023 Rev.21Publication Order Number:TND6235/DIGBT Technologiesand Applications Overview:How and When to Use an IGBTTND6235/DRev.2,MARCH 2IGBT Technologies andApplications Overview:How and When to Use an IGBTABSTRACTProliferation of high-performance

2、power conversionequipment in applications such as solar inverters,UPS,motor drives,inductive heating,welding,automotive andtraction has rekindled the interest in understanding andoptimizing IGBT characteristics in order to optimize thesystem performances.Efficiency and thermal performanceare the key

3、 metrics along with reliability and ruggedness.The power electronics environment is continuouslychanging,mainly due to new application-requirements andthe availability of new technologies in the market.Theso-called wide band gap technologies(SiC-and GaN-based)are becoming popular and most of the pow

4、er electronicsdesigners are investigating how to implement such newtechnologies in their new designs.Still the silicontechnologies are the rock-solid solution for the today design.The emphasis of this paper is to provide a framework onIGBTs:how to use them in high-power and high-voltagedesigns.A con

5、textual overview of power silicontechnologies and general topologies/applications isprovided.Common system requirements for high powerapplications are discussed.It is shown that eachend-application has a different set of requirements in termsof IGBT characteristics.In the last part,some practicaliss

6、ues related to IGBT design are covered with special focuson gate driving.Keywords:IGBT,high voltage,gate-driveINTRODUCTIONIn the last twenty years,many changes occurred in powerelectronics:from the power switches to the applicationsdesign and controls.Twenty years ago,the bipolar junctiontransistor

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本文主要介绍了IGBT技术及其应用概述,包括IGBT的工作原理、结构、优化的参数以及在不同应用中的使用。IGBT是一种基于四层交替结构(P-N-P-N)的功率半导体晶体管,通过金属氧化物半导体(MOS)门结构进行控制,没有再生作用。文章详细介绍了IGBT的发展历程,从最初的穿通(PT)技术到非穿通(NPT)技术,再到场止(FS)技术,以及最新的沟槽门技术。这些技术的改进使得IGBT在导通和开关性能、导电损耗、短路和脉冲电流承受能力等方面都有了显著的提升。 文章还讨论了IGBT在不同应用中的使用,包括焊接、感应加热、不间断电源(UPS)、太阳能逆变器和电机驱动等。对于每种应用,文章都强调了IGBT特性的不同要求,以及如何通过优化IGBT的参数来满足这些要求。例如,在焊接应用中,IGBT需要具有低导通压降和高开关速度;在感应加热应用中,需要具有高功率因数和宽负载范围;在UPS和太阳能逆变器中,需要具有高效率和良好的热性能。 总的来说,本文为理解和优化IGBT特性提供了一个框架,并展示了如何根据不同的应用需求来使用IGBT。
IGBT技术如何优化? IGBT在哪些应用中使用? IGBT在焊接和电机驱动中的应用有何不同?
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