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HBM封装需要用到GMC和LMC两类偏高端的EMC
HBM封装需要用到GMC和LMC两类偏高端的EMC
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fCBEUkFNIHwgIyBJL0YgfCBJL0YgV2lkdGggKERRIGJpdHMpIHwgTWF4IENhcGFjaXR5IHBlciBJL0YgKEdCKSB8IFNwZWVkIChNYnBzKSB8IENvbW1lbnQgfAp8IC0tLSB8IC0tLSB8IC0tLSB8IC0tLSB8IC0tLSB8IC0tLSB8CnwgRERSNSB8IDggfCA2NCB8IDUxMiB8IDUsNjAwIHwgRHVhbCAyNTZHQiBMUkRpTU1zIHwKfCBMUEREUjUgfCAxMiB8IDMyIHwgMTYgfCA3LDUwMCB8IDE2R2IgZGllLCA4RFAgfAp8IEdERFI2IHwgMTIgfCAzMiB8IDIgfCAxOCwwMDAgfCAxNkdiIFNEUkFNcyB8CnwgSEJNMyB8IDYgfCAxLDAyNCB8IDE2IHwgNCw4MDAgfCAxNkdiIGRpZSwgOEggfA==
fCDmjqXlj6PnsbvlnosgfCBHRERSNSAgfCBIQk0gIHwKfC0tLS0tLS0tLS18LS0tLS0tLS18LS0tLS0tfAp8IOS9jeWuvSAgICAgIHwgMzItYml0IHwxMDI0LWJpdCB8Cnwg5bel5L2c6aKR546HICAgfCDmnIDpq5gxNzUwTUh6ICg3R0JwcykgfCDmnIDpq5g1MDBNSHogKDFHQnBzKSB8Cnwg5bim5a69ICAgICAgfCDmr4/oiq/niYfmnIDpq5gyOEdCL3MgIHwg5q+P5aCG5Y+g5pyA6auYMTAwR0IvcyAgfAp8IOW3peS9nOeUteWOiyAgIHwgMS41ViAgIHwgMS4zViAgfA==
所属报告：
电子行业存储专题三：AI时代核心存力HBM-240528（19页）.pdf
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fCDkvIHkuJogfCDlm73lrrYv5Zyw5Yy6IHwg5biC5Zy65Lu96aKdIHwKfDotLS06fDotLS06fDotLS06fAp8IOa1t+WKm+WjqyB8IOmfqeWbvSB8IDU4JSB8Cnwg5LiJ5pifIHwg6Z+p5Zu9IHwgMjElIHwKfCDnvo7lhYkgfCDnvo7lm70gfCAyMSUgfAoKKirotYTmlpnmnaXmupDvvJoqKiDlva3ljZrvvIznlLPkuIflro/mupDnoJTnqbY=
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fCDlubTku70gICB8IOiQpeaUtuWNoOavlCB8IOS6p+iDveWNoOavlCB8CnwtLS0tLS0tLXwtLS0tLS0tLS0tfC0tLS0tLS0tLS18CnwgMjAyNCAgIHwgMTklICAgICAgfCA1JSAgICAgICB8CnwgMjAyNUYgIHwgMzMlICAgICAgfCA4JSAgICAgICB8CnwgMjAyNkYgIHwgNDElICAgICAgfCA5JSAgICAgICB8CgrotYTmlpnmnaXmupDvvJpUcmVuZEZvcmNl77yM5Lic5YyX6K+B5Yi4
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fCDlubTku70gfCDlnovlj7cgICB8IOWuuemHjy/luKblrr0gICAgICAgfCDlhbbku5bnibnmgKcgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgIHwKfC0tLS0tLXwtLS0tLS0tLXwtLS0tLS0tLS0tLS0tLS0tLS18LS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS18CnwgMjAxNSB8IEhCTSAgICB8IDJHYi8xLjBHYnBzICAgICAgfCAtICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICB8CnwgMjAxOCB8IEhCTTIgICB8IDhHYi8yLjRHYnBzICAgICAgfCAtICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICB8CnwgMjAyMCB8IEhCTTJFICB8IDE2R2IvMy4yR2JwcyAgICAgfCDkuJbnlYzmnIDlv6vlvIDlj5HvvJvDlzLlrrnph4/mr49kaWXvvJvDlzEuNeW4puWuve+8m+aPkOWNhzM2JeeDremYuyAgICAgICAgICAgICAgICAgICAgICAgICB8CnwgMjAyMiB8IEhCTTMgICB8IDE2R2IvNS42R2JwcyAgICAgfCDlhajnkIPpppbkuKrkuJTllK/kuIDph4/kuqfvvJvDlzEuNeWuuemHj++8iDEySGnloIblj6DvvInvvJvDlzEuOOW4puWuve+8m+eJh+S4ikVDQ++8m+mrmOe6p+eUtea6kOeuoeeQhu+8iOa4qeW6puWIt+aWsOeOh+aJqeWxle+8iSB8CnwgMjAyNCB8IEhCTTNFICB8IDI0R2IvOC4wR2JwcyAgICAgfCDDlzEuNeaguOW/g2RpZeWuuemHj++8m8OXMS405bim5a6977yb5o+Q5Y2HMTAl54Ot6Zi777ybMC45eOWKn+iAl+aViOeOh++8iHBKL2JpdO+8iSAgICAgICAgICAgfAp8IDIwMjYgfCBIQk00ICAgfCAtICAgICAgICAgICAgICAgIHwgMksgSU8gZm9yIEIvV++8m0pFREVD6K6o6K665Lit77yb5re35ZCI6ZSu5ZCI77yb6YC76L6R5Luj5bel5Y6CICAgICAgICAgICAgICAgICAgICAgICAgIHwKCuaVsOaNruadpea6kO+8mk5vbWFkc2Vtae+8jFNLIOa1t+WKm+Wjq++8jOS4nOWMl+ivgeWIuA==
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台积电全球晶圆代工收入市占率节节高升；三星2025Q4因2nm新品出货贡献营收，且自家HBM4使用的logicdie晶圆开始产出，淡化整体产能利用率略降的不利因素
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当前运用 TSV 技术的场景主要在 2.5D 硅中阶层和 3D 垂直叠构，其中 3D TSV 的特点在于通过垂直叠构的方式缩短了芯片间通信距离，相较于传统水平排布的方式，外围用于塑封的 EMC 及内部填料料也需要相应的升级，一方面垂直叠构导致塑封的高度显著高于传统单芯片的塑封高度，较高的高度要求外围塑封料要有充分的分散性，则 EMC 就要从传统注塑饼状变为撒粉颗粒状的颗粒状环氧塑封料（GMC，Granular Molding Compound）和液态塑封料（LMC，Liquid Molding Compound），对于 EMC 厂商，这样的升级需要在配方中同时兼顾分散性和绝缘性，配方难度较大；另一方面采用 TSV 方式连接的芯片需要一起塑封，则单个塑封体中的运算量急剧上升，从而带来较大的发热问题，需要大量使用 low α球铝和球硅来保证快速散热和控制热膨胀问题。以 HBM 为例，1 颗 HBM 中将搭载 4-8 颗甚至更多芯片，封装高度高且存储带宽大，需要用添加 low α球硅/球铝的 GMC/LMC 来做塑封外壳。
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电子行业存储专题三：AI时代核心存力HBM-240528（19页）.pdf
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