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三维堆叠制程——D2W(DietoWafer)
三维堆叠制程——D2W(DietoWafer)
行业数据
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图片大小:386KB
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所属报告:
ASMPT(0522.HK)-港股公司研究报告:AI浪潮下TCB等设备需求强劲后道龙头迎风启航-250728(31页).pdf
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D2W更适合面积较大芯片3D键合,曲线更平滑(以下非真实成本数据)
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行业数据
2025-04-01
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2027年W2W和D2W混合键合市场空间预计达到5亿、2.3亿美元
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行业数据
2024-10-14
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几种D2W键合方法对比
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其它
2024-07-10
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集体晶粒到晶圆键合(Co-D2W)键合工艺流程
fCDmraXpqqQgfCDmj4/ov7AgfAp8IC0tLSB8IC0tLSB8CnwgVHJhbnNmZXIgQ2FycmllciBQcmVwYXJhdGlvbiB8IOeOu+eSg+aIluehheWfuui9veeJh++8iOaXoOWbvuahiOaIluWvuem9kOagh+iusO+8iSB8CnwgQ2FycmllciBQb3B1bGF0aW9uIHwg6L2954mH5LiO57KY5ZCI5bGCIHwKfCBXYWZlci10by1XYWZlciBCb25kaW5nIHwgRDJX6ZSu5ZCIIHwKfCBDYXJyaWVyIFNlcGFyYXRpb24gfCDooajpnaLmuIXmtIEgfAoK6LWE5paZ5p2l5rqQ77yaRVZH5a6Y572R77yM5pa55q2j6K+B5Yi456CU56m25omA
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其它
2024-07-10
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直接贴装晶粒到晶圆(DP-D2W)键合工艺流程
fCDmraXpqqQgfCDmj4/ov7AgfAp8IC0tLSB8IC0tLSB8CnwgQ2xlYW5pbmcgQ2FycmllciBQb3B1bGF0aW9uIHwgRmlsbSBGcmFtZSB3aXRoIFNpbmd1bGF0ZWQgRGllcywgUmUtUG9wdWxhdGlvbiBvbiBDYXJyaWVyIGZvciBDbGVhbmluZyB8CnwgRGllIENsZWFuIGFuZCBBY3RpdmF0aW9uIHwgUGxhc21hIEFjdGl2YXRpb24gSGFuZGxlciwgQ2xlYW5pbmcgSGFuZGxlciB8CnwgRGlyZWN0IFBsYWNlbWVudCBGbGlwIENoaXAgfCBUcmFuc3BvcnQgQ2FycmllciwgSGlnaCBQcmVjaXNpb24gRDJXIEJvbmRpbmcgfAoK6LWE5paZ5p2l5rqQ77yaRVZH5a6Y572R77yM5pa55q2j6K+B5Yi456CU56m25omA
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其它
2024-07-10
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混合键合工艺流程(上:W2W下:D2W)
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其它
2024-06-24
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晶圆到晶圆(W2W)或芯片到晶圆(D2W),均通过删除凸点方式减薄厚度。其中W2W
fCDnsbvlnosgfCDmj4/ov7AgfAp8IC0tLSB8IC0tLSB8CnwgV2FmZXIgdG8gV2FmZXIgSHlicmlkIEJvbmRpbmcgfCBEaWUgcmVtYWluIG9uIHdhZmVyLCBBY3RpdmF0aW9uLCBjbGVhbmluZyBhbmQgdGhlbiBib25kaW5nLCBHcmluZGluZyBhbmQgdGhpbm5pbmcsIHNlbnQgdG8gcGFja2FnaW5nIHwKfCBEaWUgdG8gV2FmZXIgQ29sbGVjdGl2ZSBIeWJyaWQgQm9uZGluZyB8IERpZSB0byBiZSBib25kZWQgYXJlIHByZXBhcmVkLCBkaWNlZCwgdGhlbiBwbGFjZWQgb24gY2FycmllciB3YWZlciwgQWN0aXZhdGlvbiwgY2xlYW5pbmcgYW5kIHRoZW4gYm9uZGluZywgUmVtb3ZlIGNhcnJpZXIgd2FmZXIsIGxlYXZpbmcgYm9uZGVkIGRpZSBvbiB0YXJnZXQgd2FmZXIgfAp8IERpZSB0byBXYWZlciBTZXF1ZW50aWFsIEh5YnJpZCBCb25kaW5nIHwgU2luZ3VsYXRlZCBkaWUgYXJlIHRyYW5zZmVycmVkIHRvIGNhcnJpZXIgZm9yIGFjdGl2YXRpb24gYW5kIGNsZWFuaW5nLCBEaXJlY3QgcGxhY2VtZW50IG9mIGRpZSB1c2luZyBhIGJvbmRlciB0b29sIHwKCui1hOaWmeadpea6kO+8mlNlbWlBbmFseXNpcywgS0xB
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其它
2024-06-17
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图表27W2W和D2W混合键合技术及应用
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其它
2024-04-03
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W2W(Wafer-to-Wafer)与D2W(Die-to-Wafer)的对比
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其它
2024-03-14
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最新数据
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行业数据
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行业数据
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3D-stacking 主要有两种实现方式:晶圆到晶圆(W2W)和芯片到晶圆(D2W)。W2W相比 D2W 而言,虽然W2W工艺在制程上更为简单,堆叠效率更高,且工艺成本较低,然而,由于使用先进工艺制程的 DRAM晶圆很难达到 100%的良率,W2W的整体良率将会随着堆叠层数的增加而指数下降。例如,良率为 95%的 DRAM 晶圆进行 12 层堆叠,最终的W2W整体良率可能仅有 54%。因此,现有的 HBM都采用 D2W 方式进行生产。
行业数据
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ASMPT(0522.HK)-港股公司研究报告:AI浪潮下TCB等设备需求强劲后道龙头迎风启航-250728(31页).pdf
可比公司估值(SMT)
可比公司估值(SEMI)
公司业务营收预测(百万港元/%)
2025年HBM市场格局预测
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