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电镀液广泛应用于晶圆硅通孔(TSV)镀铜工艺
电镀液广泛应用于晶圆硅通孔(TSV)镀铜工艺
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所属报告:
电子行业深度报告:先进封装助力产业升级材料端多品类受益-240709(48页).pdf
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其它
2024-07-11
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TGV玻璃通孔与TSV硅通孔制备流程对比
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2024-05-28
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TSV与TGV的技术对比
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2024-05-28
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先进封装方面,凸块电镀、再分布线、硅通孔(TSV)电镀等是超越摩尔定律的关键。为了进一步提高集成电路性能,需要缩短晶圆间、晶圆与印刷电路板间连线距离,因此超越摩尔技术变得越来越重要,三维硅通孔、重布线、凸块工艺等先进封装工艺也因此开始大规模使用。而这三种封装工艺都需要进行金属化薄膜沉积,这将显著拉动相关电镀液的需求,如铜、镍、锡、银、金电镀液等。
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电子行业深度报告:先进封装助力产业升级材料端多品类受益-240709(48页).pdf
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