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半导体封测行业深度报告：摩尔定律重要方向先进封装大有可为-240513（132页）.pdf
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相关数据
引线键合（左）与BGA封装（右）
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行业数据
2026-03-24
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基板封装（球栅阵列BGA和平面网格阵列LGA）
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其它
2023-12-13
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WB-BGA封装环节成本构成
5qC55o2u5oKo5o+Q5L6b55qE5L+h5oGv77yM5Lul5LiL5piv5pWw5o2u6KGo5qC85ZKM6LWE5paZ5p2l5rqQ77yaCgojIyMg5pWw5o2u6KGo5qC8Cgp8IOaIkOacrOaehOaIkCAgIHwg55m+5YiG5q+UIHwKfC0tLS0tLS0tLS0tLXwtLS0tLS0tLXwKfCDlsIHoo4Xln7rmnb8gICB8IDMwJSAgICB8Cnwg5rWL6K+VICAgICAgIHwgMjUlICAgIHwKfCDorr7lpIfmipjml6cgICB8IDI1JSAgICB8Cnwg6KOF6YWNK+adkOaWmSAgfCAyMCUgICAgfAoKIyMjIOi1hOaWmeadpea6kArok53mtbfllYbkv6HvvIzotKLpgJror4HliLjnoJTnqbbmiYA=
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行业数据
2023-03-16
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预计2021-2025年全球FC-BGA/LGA/PGA产值
fCDlubTku70gfCBGQyBQR0EvTEdBL0JHQSB8IEZDIENTUC9GQy1CT0MgfCBXQiBQQkdBL0NTUCB8IE1vZHVsZSB8CnwtLS0tLS18LS0tLS0tLS0tLS0tLS0tLXwtLS0tLS0tLS0tLS0tLS0tfC0tLS0tLS0tLS0tLS0tfC0tLS0tLS0tfAp8IDIwMTEgfCAkNS4wMCAgICAgICAgICB8ICQyLjAwICAgICAgICAgIHwgJDEuMDAgICAgICAgIHwgJDEuMDAgIHwKfCAyMDE4IHwgJDQuMDAgICAgICAgICAgfCAkMS41MCAgICAgICAgICB8ICQxLjAwICAgICAgICB8ICQwLjUwICB8CnwgMjAxOSB8ICQ0LjUwICAgICAgICAgIHwgJDEuNTAgICAgICAgICAgfCAkMS4wMCAgICAgICAgfCAkMC41MCAgfAp8IDIwMjBFfCAkNS4wMCAgICAgICAgICB8ICQyLjAwICAgICAgICAgIHwgJDEuMDAgICAgICAgIHwgJDEuMDAgIHwKfCAyMDIxRnwgJDYuMDAgICAgICAgICAgfCAkMi41MCAgICAgICAgICB8ICQxLjUwICAgICAgICB8ICQxLjAwICB8CnwgMjAyNUZ8ICQxMC4wMCAgICAgICAgIHwgJDQuMDAgICAgICAgICAgfCAkMi4wMCAgICAgICAgfCAkMi4wMCAgfAoK6LWE5paZ5p2l5rqQ77yaUHJpc21hcmvjgIHlvIDmupDor4HliLjnoJTnqbbmiYA=
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行业数据
2023-01-17
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公司规划封装基板产品从FC-CSP迈向FC-BGA
5Lul5LiL5piv5qC55o2u5Zu+54mH5Lit55qE5pWw5o2u55Sf5oiQ55qE6KGo5qC877yM5bm25Zyo6KGo5qC85LiL5pa55bGV56S65LqG6LWE5paZ5p2l5rqQ77yaCgp8IOWfuuWcsCAgICAgICAgICAgfCDkuqfog70gICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICB8IOaJqeS6p+iKguWljyAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgIHwKfC0tLS0tLS0tLS0tLS0tLS18LS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tfC0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS18Cnwg5bm/5bee5Z+65ZywICAgICAgIHwgMuS4h+W5sy/mnIggICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgfCAyMDEy5bm05oqV5LqnMeS4h+W5sy/mnIjvvIwyMDE45bm05oqV6LWE5omp5LqnMeS4h+W5sy/mnIjkuo4yMDIw5bm06YeK5pS+5Lqn6IO9ICAgICAgIHwKfCDnj6DmtbflhbTnp5HvvIjlpKfln7rph5HlkIjkvZzvvIkgfCDnrKzkuIDmnJ80LjXkuIflubMv5pyI77yI5YiGM+W5tOaKlei1hO+8jOavj+W5tOaKlei1hDEuNeS4h+W5sy/mnIjvvInvvIzmu6HkuqflubTkuqflgLznuqbkuLoyMOS6vyB8IOesrOS4gOacnzEuNeS4h+W5sy/mnIjkuqfnur/lt7Llu7rmiJDvvIzpooTorqEyMDIy5bm0NuaciOWwj+aJuemHj++8mzIwMjPlubTlupXliY3lu7rmiJDmipXkuqcgfAp8IOW5v+W3nkZDQkdBICAgICAgfCDmipXotYTnuqY2MOS6v+WFg+WIhuS4pOacn+W7uuiuvuaciOS6p+iDvTIwMDDkuIfpopfnmoRGQ0JHQeWwgeijheWfuuadv+mhueebriAgICAgICB8IOetueW7uumYtuaute+8jDIwMjTlubTph4/kuqfniKzlnaEgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgICAgIHwKCui1hOaWmeadpea6kO+8muWFrOWPuOWFrOWRiuOAgeaKlei1hOiAheWFs+ezu+a0u+WKqOiusOW9leihqOOAgeW8gOa6kOivgeWIuOeglOeptuaJgA==
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速得到发展。目前高密度、高性能、高频率的IC芯片都已采用该类型的封装技术。此外，在SMT工艺质量控制相当成熟的今天，BGA的焊接一直是备受关注的环节。一个OEM代工电子厂的制程能力，在很大程度上取决于BGA的焊接水平。
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半导体封测行业深度报告：摩尔定律重要方向先进封装大有可为-240513（132页）.pdf
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