1、 I:,:.mksMKS HANDBOOK$Process Technologies00 in Advanced Packaging-?_?by the Office of the CTO.MKS HandbookProcess Technologies in Advanced Packagingby the Office of the CTODive deep into the Future of Semiconductor Integration and explore the engineering behind Advanced Packaging the key to sustain

2、ing Moores Law in the post-scaling era.As traditional transistor scaling approaches its physical limits,the semiconductor industry is turning to Advanced Packaging to maintain performance growth.This paradigm shift enables the integration of multiple heterogeneous dies into a single package,unlockin

3、g new levels of functionality,bandwidth,and power efficiency.Our Process Technologies in Advanced Packaging Handbook is a comprehensive technical resource for anyone who wants to understand the next frontier in semiconductor design and manufacturing.What youll gain from this handbook:A foundational

4、understanding of heterogeneous integration and chiplet architecturesDetailed insights into interposer technologies,through-silicon vias(TSVs),RDLs,andhigh-density interconnectsProcess flows and equipment used in 2.5D/3D packaging,fan-out wafer-levelpackaging(FOWLP),and system-in-package(SiP)solution

5、sWhether youre designing next-gen systems or studying semiconductor fabrication,this handbook will equip you with the technical depth to innovate in a rapidly evolvinglandscape.Download the complete Handbook and get hands-on with the technologies shaping the future of electronics.5/2025 2025 MKS Inc

6、.All rights reserved.Limit of Liability/Disclaimer of Warranty:The purpose of this book is to educate and should be used only as a general guide.The authors and publisher are providing this book and its contents on an“as is”basis and make no representations or warranties of any kind.Neither the auth