20250121_PreConC_Beica.PDF

1、1Rapid&Unified Manufacturing for Next Generation Devices&Packaging I Chiplet Summit I 21 January 2025 I Santa Clara,CARapid&Unified Manufacturing forNext Generation Devices&PackagingRozalia BeicaField CTO Packaging TechnologiesRapidus Design Solutions2Rapid&Unified Manufacturing for Next Generation

2、Devices&Packaging I Chiplet Summit I 21 January 2025 I Santa Clara,CAPRESENTATION OUTLINEINDUSTRY TRENDSADVANCED MANUFACTURINGSemiconductor Industry GrowthArtificial Intelligence ImpactADVANCED PACKAGING TRENDSChiplet&Heterogeneous InterationHigh-End Packaging TrendsAI A PARADIGM SHIFT IN HIGH PERFO

3、RMANCE COMPUTING DRIVING FOR NEW&INNOVATIVE SOLUTIONS Foundry ConsiderationsInnovative Integrated SolutionsThe Growth and Importance of Advanced Packaging&Heterogeneous Integration I Rapidus I 30 October 2024 I Tokyo,JP3Industry TrendsRapid&Unified Manufacturing for Next Generation Devices&Packaging

4、 I Chiplet Summit I 21 January 2025 I Santa Clara,CAIMPACT 2024 I S29 Design,Modeling,AI/Machine Learning Applications,and Testing/Smart Manufacturing I 25 October 2024 I Taipei,TWTHE GROWTH OF THE SEMICONDUCTOR INDUSTRYComputingMobileInformation Age19902000201020202030.and many more applications to

5、 come 1 TrillionDevices 20172021:$0.5T Revenue$1T by 20304In the past,there was always One Key Technology driving the roadmap:PC-Mobile-Smartphone-Information AgeNow there are multiple growth technologies ramping at the same time:AI,5G,Datacenter,VR/AR,IIoT,Autonomous Driving,etc.AI&HPC are driving

6、an unprecedented market inflection,with innovation needed to satisfy the demand and requirementsRapid&Unified Manufacturing for Next Generation Devices&Packaging I Chiplet Summit I 21 January 2025 I Santa Clara,CAIMPACT 2024 I S23 MKS ATOTECH ADVANCING AI CHIPS FROM SILICON TO PCB I 23 October 2024