Data Center Modular Hardware System (DC-MHS) Overview & Update.pdf

1、DC-MHS Overview&UpdateIT Ecosystem:Server&StorageDC-MHS Overview&UpdatePaul Artman,Director System Design,AMDDirk Blevins,Senior Platform Architect&Principal Engineer,Intel CorporationRob Nance,Director of Technology,JabilNew Model w/DC-MHSM-XIO/PESTIWorkstreamCharlie Z.(Dell)Javier L.(Intel)Open Co

2、mpute DC-MHS Sub-ProjectBrian Aspnes(Intel)Shawn Dube(Dell)M-PICWorkstreamTim L.(Dell)Cliff D.(Intel)M-CRPSWorkstreamJon L.(Dell)Aurelio R.(Intel)M-HPMWorkstreamCorey H.(Dell)Brian A.(Intel)M-FLWSpecificationCorey H.(Dell)Brian A.(Intel)Mechanics of CollaborationM-SIFWorkstreamGreg S.(AMD)Dirk B.(In

3、tel)M-DNOSpecificationMike G.(Dell)Dirk B.(Intel)M-HPM.nextSpecificationTBD(TBD)TBD(TBD)DC-MHS=Datacenter Modular Hardware System1.Modular Host Processor Modules(M-HPM)oModular FulL Width HPMs(M-FLW)oModular DeNsityOptimized HPMs(M-DNO)oModular Next HPMs(M-HPM.next)2.Modular PlatformInfrastructure C

4、onnectivity(M-PIC)3.Modular Common Redundant Power Supply(M-CRPS)4.Modular eXtensibleI/O(M-XIO)+Modular PEripheralSideband Tunneling Interface(M-PESTI)5.Modular SharedInFrastructure(M-SIF)Six v1.0 specifications were released to the OCP Contribution Database in September 2022Plan to continue develop

5、ing the v1.x specificationsDC-MHS WIKI contains specification updates,eratta,updated modeshttps:/www.opencompute.org/wiki/Server/DC-MHS2023 focused on three new specifications in addition to spec updatesM-HPM.nextSpecificationSpecification optimized around wider HPMs and ORv348V System Architecture

6、SpecificationM-SIF SpecificationShared infrastructure focused on shared Cooling,Power,I/O and ManagementDC-MHS Update for 2023Next HPM Form Factors ScopeDC-MHS Home Page:https:/www.opencompute.org/projects/dc-mhsDC-MHS WIKI:https:/www.opencompute.org/wiki/Server/DC-MHSDC-MHS Mailing List:https:/ocp-