Special Presentation 5：OCP NIC 3.0.pdf

1、OCP NIC 3.0Millions shipped Server Group NIC Sub-Project 3.0 Specification v1.2.06.5 years in the making 16 contributorsv1.2.0 Specification Manageability Sideband:RBT/SMBus Transports:RBT&MCTP NC-SI PT MAC provisioning Temp&Power Firmware inventory FRU EEPROMSecurity Secure boot Secure FirmwareServ

2、iceabilitySafetyTest FixturesPCIe Up to 32x Gen5 4 Multi-Host Lane BifurcationPower Power states Power down sequenceOCP NIC 3.0-Form FactorsSmall Form-FactorQSFP,SFP,BASE-T,OSFP,QSFP-DDLarge Form-Factor Real Estate|Higher Power|x32 PCIeTall Small Form-FactorThermal PerformanceW 76 mmD 115 mmH 11.5 m

3、mW 139 mmD 115 mmH 11.5 mmW 76 mmD 115 mmH 14.2 mmSFFT-SFFLFFSmart NICs-LFF vs SFF SFF and LFF are not plug-compatible Platforms and adapters are commonly SFF today Ideas:Double-SFF(D-SFF)which fits into two SFF slots QSFP-DDOpenQSFP-DDOpenOCP Type-3 Wide I/O CardDC-SCMASPEEDAST2700OB1OB14B1B28B29B4

4、2B43B70BMC FlashBIOS FlashTPMOCP S-FLW LargeProcessorProcessorQSFP-DDOpenOCP Type-3 SFF I/O CardQSFP-DDOpenOCP Type-3 SFF I/O CardDC-SCMASPEEDAST2700OB1OB14B1B28B29B42B43B70BMC FlashBIOS FlashTPMOCP S-FLW LargeProcessorProcessorRequires Different ConnectorNew DSFF Uses same connectors Motherboard wi

5、th 1x LFFMotherboard with 2x SFFSFFSFFLFFIdea-Double SFF for Smart NICsSpans over two 4C+connectors Spaced per M-FLW HPM specification Regular and Tall options 160 Watt x32 PCIe lanes13%more board space than LFFOpens:Management scheme Latching mechanism MoreOCP Type-3 DoubleWideQSFP-DDOpenNICQSFP-DD

6、Open116.61mm,4.596.1882mm.07915.10mm0.594QSFP-DDQSFP-DDOCP Type-3 DoublewideQSFP-DDQSFP-DD115mm,4.53SFF FaceplateOSFP116.61mm,4.592mm.07915.10mm0.594QSFP-DD115mm,4.5317.80mm0.700SFF FaceplateTSFF Faceplate2mm.079IllustrationCall to Action A