1、Information Classification:GeneralWelcome to ConferenceJanuary 2830,2025Santa Clara Convention Center1ExpoJanuary 2930,2025 Information Classification:GeneralPerspectives on Managing Intra-Pair Skew in Copper Cable Assemblies for High-Volume DeploymentsSam Kocsis(Amphenol)Tahoura Mosavirik(Ph.D.Cand
2、idate at WPI,and Amphenol Intern)Mustafa Boyvat(Amphenol)Hari T.(Microsoft)2Information Classification:GeneralImageSPEAKERSSam KocsisDirector of Standards and Technology,AmphenolSam Kocsis currently holds the role of Director of Standards and Technology at Amphenol,focusing on the proliferation of i
3、nnovative interconnect solutions.Sam coordinates Amphenols engagement strategies in various industry standards and consortiums across networking,server/storage,optics,and commercial markets.He is active in IEEE 802.3,and OCP projects,and currently serves as the Technical Committee Vice Chair at the
4、OIF,is Co-Chair of the OSFP MSA and the Chairman of the PCI-SIG Cabling Workgroup.Sam holds BSEE and MSEE degrees from the University of Rochester,in Rochester,New York.3Information Classification:GeneralImageSPEAKERSTahoura MosavirikPh.D.Candidate at Worcester Polytechnic Institute(WPI)Intern,Amphe
5、nolTahoura Mosavirik is currently pursuing the Ph.D.degree in Electrical Engineering at Worcester Polytechnic Institute(WPI),Worcester,MA,USA.Tahoura worked at Intel Corporation,Amphenol,and Apple Inc.as a Signal Integrity Engineering Intern.She received the B.Sc.degree from Imam Khomeini Internatio
6、nal University,Qazvin,Iran,in 2017,and the M.Sc.degree from the Iran University of Science and Technology,Tehran,Iran,in 2020,both in Electrical Engineering.Her research interests include signal integrity,hardware security,and applied electromagnetics.She received the Peter B.Myers Award for Excelle