DC25_PAPER_Track10_ThermalAnalysisandOptimizedDesign_Bae_V3.pdf

1、 Information Classification:General Thermal Analysis and Optimized Design for Power Ground Vias of PMIC in DDR5 DIMM Byungjin Bae,Samsung Electronics Wonji Hwang,Samsung Electronics Wooshin Choi,Samsung Electronics Young-Chul Cho,Samsung Electronics Jung-Hwan Choi,Samsung Electronics Young-Soo Sohn,

2、Samsung Electronics Sunghoon Chun,Samsung Electronics Information Classification:General Abstract This paper analyzes the impact of the power ground(PGND)pattern and vias of the PMIC on the temperature of the PMIC in DDR5 DIMMs.On the evaluation board for PMICs,the temperatures of a PMIC are measure

3、d and compared when the number of PGND vias is 4,14,and 30.Under the worst load condition,an electronic current loader with maximum output current of the PMIC is connected to each channel of the PMIC and operated,with measurements taken until the temperature of the PMIC reaches saturation.From the t

4、emperature measurement results,it was observed that as the number of ground vias increases,the temperature of the PMIC decreases,and the temperature difference becomes more significant with higher load currents.Furthermore,to verify the exclusive effect of heat generation due to DCR of via on the te

5、mperature of the board,a DC current was applied to the pattern of a PCB with only vias,and the board temperature was measured and analyzed based on the number of vias.The addition of ground vias not only achieves the effect of adding thermal vias but also reduces the DCR of the PGND path for the PMI

6、C,effectively mitigating thermal issues.Author(s)Biography Byungjin Bae received the B.S.and Ph.D.degrees in electrical engineering from Ulsan National Institute of Science and Technology,Ulsan,South Korea,in 2017 and 2023,respectively.From 2023,he is currently with the Samsung Electronics,Hwaseong,