DC25_PAPER_Track05_CAMMNewStandardMemory_Kocsis.pdf

1、 Information Classification:General CAMM:The New Standard for Memory Sam Kocsis,Amphenol Tom Schnell,Dell Zhineng Fan,Amphenol Trent Do,Amphenol Jason CF Lin,Amphenol Information Classification:General Abstract Memory interfaces in personal laptops have long relied on a Slotted Dual In-Line Memory M

2、odule(DIMM).In 2023,JEDEC standardized the Compression Attached Memory Module(CAMM2)solution to enable a more forward-looking approach aimed at optimized routing paths,lower power,higher speed,and easier serviceability.The CAMM2 JEDEC standard is derived from the CAMM solution,developed by Dell Tech

3、nologies.The CAMM attachment mechanism uses a land grid array(LGA)technology.Implementations of the CAMM connector take advantage of the quality of the compression contact technology and the ability to create reliable mating interface for multiple mating cycles.The CAMM solution supports dual-and si

4、ngle-channel memory module with a low-profile stack height.This session will explore the high-level features of the CAMM solution but focus on the mechanical reliability of the interface via standard quality and reliability metrics.The paper will explore the best practices for integrating CAMM inter

5、face into your system and describe how CAMM style solutions may have a market beyond personal laptops including the data center.The timing of this effort is aimed at being helpful,ahead of anticipated broad market adoption of the JEDEC CAMM2 solution.Information Classification:General Author(s)Biogr

6、aphy Sam Kocsis currently holds the role of Director of Standards and Technology at Amphenol,focusing on the proliferation of innovative interconnect solutions.Sam coordinates Amphenols engagement strategies in various industry standards and consortiums across networking,server/storage,optics,and co