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ResearchInChina:2024汽车驾驶舱SoC(系统级芯片)研究报告(简版)(中译版)(23页).pdf

上传人: Kell****reet 编号:182224 2024-11-22 23页 1.79MB

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1、Automotive CockpitSoCResearchReport,2024M Automotive Cockpit SoC Research:Automakers quicken their pace of buying SoCs,and thepenetration of domestic cockpit SoCs will soarMass production of local cockpit SoCs is accelerating,and thelocalization rate will reach up to 25%in 2030.Chinese electric vehi

2、cle makers are quickening their pace ofpurchasing domestic chips,so as to lessen their dependenceon imported chips.According to the informal goals,it isexpected that the overall penetration of homemade automotivechips will be increased to higher than 20%in 2025,and state-owned and private automakers

3、 will be encouraged to purchasedomestic chips.This is undoubtedly a great boon to Chinesecockpit SoC vendors.According to ResearchInChinas statistics,Chinas local cockpitSoCs took a just about 4.8%share of the Chinese passengercar market in 2023.Driven by policies and technologicalmaturity,it is con

4、ceivable that the penetration of domesticcockpit SoCs will further rise,up to 25%in 2030.At present,local cockpit SoC vendors are in the rapiddevelopmentphase,speedingupthelaunchandmassproduction of new products.Quite a few local cockpit SoCvendors such as SemiDrive,SiEngine,AutoChips and Huaweihave

5、 achieved large-scale mass production and covered muchmore passenger car SemiDrives X9 familySemiDrives X9 family of intelligent cockpit productscovers entry-level to flagship-level cockpit applicationscenarios,for example,cluster,IVI,cockpit domaincontrolandcockpit-parkingintegration,meetingdiverse

6、 needs,with shipments of over one millionpieces,rich mass production experience and matureecosystem.Automakers like SAIC,Chery,Changan,GAC,BAICandDongfengNissanallhavemass-producedmodelsequippedwithX9SoC.Manyleadingautomotive software ecosystem partners inside andoutside China,such as AliOS,QNX,Unit

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本文主要介绍了2023-2024年汽车座舱SoC(系统级芯片)的发展情况。 1. 2023年,中国本土座舱SoC市场占有率仅为4.8%,预计到2030年将达到25%。 2. 国内座舱SoC供应商如SemiDrive、SiEngine、AutoChips等正在快速发展,产品覆盖更多车型。 3. 2023年,SemiDrive的X9系列座舱SoC出货量超过100万片,获得多家汽车厂商采用。 4. 2024年,SemiDrive推出X9H 2.0G座舱SoC,性能提升,支持更多功能。 5. 国外厂商如高通、英伟达、英特尔、AMD等也在积极布局座舱SoC市场,推出新产品。 6. 2024年,MediaTek与英伟达合作推出3nm工艺座舱SoC,挑战高通的领先地位。 7. 英特尔、AMD等也在推出新一代高性能座舱SoC,提升市场竞争力。 8. 座舱SoC市场呈现“一超多强”的竞争格局,未来将更加多元化。 9. 座舱SoC技术不断进步,先进制程和芯片技术被广泛应用。 10. 座舱SoC市场发展迅速,与消费电子市场趋势相似。
2024年智能座舱SoC市场发展有何新趋势? 国内外智能座舱SoC供应商竞争格局如何? 智能座舱SoC在汽车中的哪些应用场景最受欢迎?
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