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IEEE:2026全球数据中心发展趋势报告(英文版)(28页).pdf

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1、INDUSTRY CONNECTIONS WHITE PAPER IC24-016 OPEN DATA CENTER INITIATIVE(ODCI)GLOBAL DEVELOPMENT TRENDS OF DATA CENTERS Authored by L Lina ina X Xie ie Deputy Director of Data Center Department,CAICT Cloud Computing and Big Data Research Institute LiangLiang GuoGuo Chief Engineer,CAICT Cloud Computing

2、and Big Data Research Institute Authorized licensed use limited to:IEEE Xplore.Downloaded on March 26,2026 at 03:05:13 UTC from IEEE Xplore.Restrictions apply.Copyright 2026 IEEE.All rights reserved.2 IEEE SA INDUSTRY CONNECTIONS TRADEMARKS AND DISCLAIMERS IEEE believes the information in this publi

3、cation is accurate as of its publication date;such information is subject to change without notice.IEEE is not responsible for any inadvertent errors.The ideas and proposals in this specification are the respective authors views and do not represent the views of the affiliated organization.ACKNOWLED

4、GMENTS The authors would like to thank the following contributors/supporters of this white paper:Shiru Duan,Researcher,Shiru Duan,Researcher,CAICT Cloud Computing and Big Data Research Institute Zongying He,Zongying He,Director,Broadcom Zekun He,Zekun He,Director of the Basic Network Center,Tencent

5、Huixian Han,Huixian Han,Senior Expert,Vertiv Yanxiang Hou,Yanxiang Hou,Chief Architect of Data Center Network Solutions,Huawei Shilen Jhaveri,Shilen Jhaveri,Product Manager,Google Dianlin Li,Dianlin Li,Head of New Technology R&D for Data Centers,Kwai Jie Li,Jie Li,Deputy Director,CAICT Cloud Computi

6、ng and Big Data Research Institute Jiayuan Li,Jiayuan Li,Researcher,CAICT Cloud Computing and Big Data Research Institute Xiang Li,Xiang Li,Director of Open Source and Standards for Cloud Computing,ZTE Xinning LiuXinning Liu,Researcher,CAICT Cloud Computing and Big Data Research Institute Qianfang S

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1. **全球数据中心规模与政策**:AI驱动全球数据量激增,预计2028年达393.8ZB(CAGR 24.4%);美中分别占全球智能算力32%、26%。各国政策聚焦算力基建,如美国“AI行动计划”、中国“东数西算”。 2. **技术发展趋势**: - **算力层**:供电向800V HVDC演进,液冷加速普及(超算单柜功率超100kW); - **IT层**:芯片向Chiplet/3D封装、CIM架构发展,存储介质向3D NAND/SCM升级,网络向光融合(CPO/OCS)演进; - **运维层**:跨平台管理、数字孪生驱动无人化运维。 3. **挑战与展望**:核心瓶颈(如芯片制程)、能耗压力(“双碳”目标)、标准缺失。未来需突破关键技术(如光子计算)、深化全球协作与标准共建。
**AI芯片竞争?** **液冷技术趋势?** **算力如何协同?**
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