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德国联邦研究、技术与航天部:2025德国联邦政府微电子战略报告(中译版)(35页).pdf

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1、Microelectronics Strategy of the German Federal GovernmentResearch,Skilled Workforce and Manufacturing for the Microelectronics-Ecosystem in GermanyContentAbstract 2Why microelectronics?5Global competition 6What challenges does Germany face?8Objectives of this strategy 10The approach in six fields o

2、f action 13Field of action 1:Expanding chip design capabilities.14Field of action 2:Transfer“from lab to fab”.16Field of action 3:Skilled workers increasing numbers.18Field of action 4:Skilled workers improving quality.21Field of action 5:Stimulating investment.23Field of action 6:European and inter

3、national cooperation.25Framework conditions 27Concerted action and national coordination 30Impressum 32 1AbstractWith this strategy,the German Federal Government has created a framework to implement targeted and consistent measures in the field of microelectronics,therefore making a significant cont

4、ribution to the Federal Governments High-Tech Agenda for Germany as well as taking advantage of the opportunities offered by the European Chips Act(ECA)1.Europes position in the microelectronics sector has a broad impact on Germanys innovative and economic strength and thus on its ability to remain

5、sovereign in the face of geopolitical tensions.The systematic development of the microelectronics sector in Germany and Europe is,therefore,of great interest to the Federal Government.Together with its European partners,Germany is in a promising position to strengthen its innovative capacity and to

6、secure its technological sovereignty2 and resilience in the field of microelectronics.Research and development,a skilled workforce,and investment in industrial pilot projects and innovative manufacturing form the basis of international competitiveness and sustainable value creation.Promoting and exp

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1. **战略目标**:德国联邦政府制定微电子战略,旨在提升德国作为微电子枢纽的吸引力,增强德欧技术主权和供应链韧性,应对全球竞争与地缘政治挑战。 2. **核心领域**: - **芯片设计**:扩展设计能力,重点发展AI芯片、异构集成(chiplet)及开源设计(如RISC-V),建立“可信芯片”标准。 - **研发转化**:通过“研究工厂”(FMD)推动“从实验室到工厂”的转化,投资先进封装技术,2026年启动试点线。 - **人才与制造**:解决技能短缺(预计2027年后需2万-3万技术工人),刺激投资(如IPCEI项目),加强欧洲合作(如欧盟《芯片法案》)。 3. **关键数据**: - 德国占欧洲晶圆产能约30%,微电子直接贡献GDP的4%,间接贡献15%。 - 全球半导体市场预计2030年显著增长,欧洲当前产能占比仅13%。 - 德国通过IPCEI项目投资40亿欧元,创造3200个直接就业岗位。
**芯片战略亮点?** **德国如何培养人才?** **全球竞争有何挑战?**
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