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美国半导体协会:2025半导体研发项目:美国技术领导力的必要创新研究报告(中译版)(18页).pdf

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1、 SEMICONDUCTOR R&D PROGRAMS:Essential Innovation for U.S.Technology Leadership June 2025 2 Introduction I.Importance of Semiconductor Research Programs II.NAPMP:Innovating Through Advanced Packaging Technologies III.NSTC:Innovating the Full Semiconductor Technology Stack IV.SMART USA:Innovating thro

2、ugh Digital Twins V.Metrology:Innovating through Precision,Verification,and Digital Assets Conclusion:Winning the Chip Race through NAPMP,NSTC,SMART USA,and Metrology Appendix I:National Advanced Packaging Manufacturing Program(NAPMP)Program Descriptions Appendix II:National Semiconductor Technology

3、 Center(NSTC)Facilities Descriptions CONTENTS 3 5 8 10 12 13 14 15 16 3 Introduction U.S.leadership in semiconductor technology is vital to economy and U.S.leadership in semiconductor technology is vital to economy and national security.national security.To win the competition for technology leaders

4、hipas well as for critical industries enabled by semiconductors,such as artificial intelligence,high performance computing,advanced communications,quantum,energy,defense,medical technology,and transportationthe U.S.must resecure its role as the epicenter of semiconductor innovation.Federal research

5、programs established through the Fiscal Year 2021 National Defense Authorization Act and funded under the CHIPS and Science Act are working to meet the changing nature of the industry,its technologies,and most importantly how it operationalizes innovation.These investments are beginning to address s

6、pecific gaps in American semiconductor competitiveness,resilience,and supply chain security.And,they are being made at a critical time in which dramatic industry changes are renegotiating the geography of innovation.Key TakeawaysKey Takeaways 1.To win the global competition for technology leadership

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1. **核心目标**:美国通过CHIPS R&D Programs维持半导体创新领导地位,应对全球竞争(如中国2025年投入550亿美元)。 2. **四大项目**: - **NAPMP**(国家先进封装制造计划):投资11亿美元,聚焦AI/HPC先进封装的6大研发领域(如材料/基板),已投入3亿美元并建立1.1亿美元的中试设施。 - **NSTC**(国家半导体技术中心):获63亿美元资助,建设3大设施(如EUV加速器、设计协作中心),推动全栈创新与人才培养。 - **SMART USA**:投入2.85亿美元,联合超10亿美元行业资金,通过数字孪生技术降低芯片研发成本40%、周期35%。 - **计量项目**:开发高精度测量工具与数字资产,支持先进工艺验证。 3. **关键进展**:项目已启动部分研发与设施建设,需持续资金支持以保持行业优先级 alignment。
**芯片研发竞赛?** **美国如何领先?** **创新关键在哪?**
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