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机器学习在集成电路物理设计中的应用及部署.pdf

上传人: 芦苇 编号:651852 2025-05-01 25页 1.32MB

1、Use Cases and Deployment of ML in IC Physical Design Amur Ghose,aghoseucsd.eduAndrew B.Kahng,abkucsd.eduSayak Kundu,sakunduucsd.eduYiting Liu,yil375ucsd.eduBodhisatta Pramanik,bopramanikucsd.eduZhiang Wang,zhw033ucsd.eduDooseok Yoon,d3yoonucsd.edu2AI/ML techniques have been applied to many IC physic

2、al design challenges,e.g.:Hyperparameter autotuning for better PPA tool settingsML Predictions of routing hotspots,doomed runs,and PPARouting blockage creation to improve routability and PPABut:practical challenges are seen in ML deployment Why have so many efforts fallen short?This talk:Issues surr

3、ounding data for MLHigh-level principles for deploymentBasic“checklists”for data,models,and use casesContext for MLOps and LLM-based application developmentMotivation3Agenda Data Data Outside vs.Inside IC Design Challenges and Ongoing Efforts(Academia and Industry)ML Deployment Key Performance Indic

4、ators(KPIs)and Checklists Machine Learning Operations(MLOps)and Commoditization Challenges for LLM Deployment LLM EDA:Software Engineering Issues Challenges from EDA Flows4 Data is a core concern in ML for IC designData in PD:Scope,Modalities,Challenges Example ChallengesDiverse IC data typesFormal

5、specsHDLGraphsHierarchiesTabular dataImagesHard for GenAI to interpret Generalization across modalitiesIC design data is costly to produceHuge scale,as well!High-quality public data is scarceUnshareable due to proprietary rightsPDK dataCommercial librariesSoft IP dataEDA vendor dataScarce and propri

6、etary data Data qualityLarger datasets do not guarantee better ML models Common problems:Outdated,stale dataIncomplete coverageRisks such as data poisoning5Many initiatives,contributions to mitigate data scarcity Artificial netlist generators(ANG+),proxy PDKs(ASAP7+)Open-source toolchains(OpenROAD,i

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本文探讨了机器学习在集成电路物理设计中的应用案例和部署挑战。作者指出,尽管AI/ML技术在IC物理设计挑战中取得了进展,如自动调优、路由热点预测等,但在实际部署中面临诸多挑战。文章强调了数据在ML中的核心作用,包括数据类型多样、获取成本高昂、质量参差不齐等问题。同时,提出了数据管理、模型性能、MLOps和LLM部署等方面的关键性能指标和检查清单。文章还讨论了如何克服数据稀缺性和促进学术界与工业界的合作,以及MLOps和LLM在EDA领域的应用。最后,作者指出,尽管存在挑战,但ML在IC物理设计中的应用前景广阔,吸引了大量风险投资和关注。
"AI/ML在IC物理设计中的挑战与机遇" "如何提升ML在IC设计中的应用效果?" "LLM与EDA结合的未来发展趋势探讨"
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