最新形态.pdf

1、1|2024 SNIA.All Rights Reserved.The Latest on Form FactorsPresented by Jonmichael HandsCo-chair SSD SIG2|2024 SNIA.All Rights Reserved.EDSFF Value Optimized form factor for different enterprise and data center use cases Compute SSD:E1.S,designed to fit in 1U server,hot plug,modular,heat sink options

2、 for different environments.Higher capacity than M.2,same performance as U.2 Storage:E1.L,E3.L,designed for max capacity per rack unit Mainstream enterprise server:E3.S,support 1U and 2U server,higher drive count than U.2 for more io performance CXL:E3.S 2T,Performance scaling More drives per server

3、 for higher throughput and IOPS Interface future-proof Support for PCIe 5.0,6.0,CXL 2.0/3.0 Thermal efficiency Lower airflow to reduce power from fans,heatsink options3|2024 SNIA.All Rights Reserved.EDSFF Spec UpdateSFF SpecTitleDescriptionLatest VersionNew FeaturesSFF-TA-1006E1.S1U short form facto

4、r1.5(Aug 2021)Power is informative nowSFF-TA-1007E1.L1U long form factor,capacity optimized1.2(July 2021)SFF-TA-1008E3Defines E3.S,E3.S 2T,E3.L,E3.L 2T2.1(Oct 2023)Addition of NIC sidebands,2x1C,clarificationsSFF-TA-1002ConnectorProtocol Agnostic Multi-Lane High Speed Connector1.5(April 2024)PCIe 6.

5、0 support,additional SM thickness,errata.SFF-TA-1033:Internal High-Speed Cable/Modular Connector SystemSFF-TA-1009Pin and Signal Specificationpin list and pin placement,function of the pins,device specific electrical requirements,and specific features of enterprise and datacenter-based devices4.0(Ma

6、y 2024)PCIe 6.0 support,CXL LEDSFF-TA-1034Pluggable Multipurpose Module(PMM)New specification built for general purpose devices in a front or rear loadable form factor1.0(May 2024)SFF-TA-1023EDSFF ThermalDefines thermal and airflow requirements1.0a4|2024 SNIA.All Rights Reserved.Superior Signal Inte