Cooling Environments Project Overview & Roadmap for a Durable Chip Coolant Temperature.pdf

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1、Cooling Environments Update and Cooling Environments Update and Roadmap for a Durable Chip Coolant TemperatureRoadmap for a Durable Chip Coolant TemperatureSteve Mills-META-Open Compute Steering Committee MemberCosimo Peccioli-BP-Cooling Environments Co-LeadCooling Environments Project Cooling Envir

2、onments Project UpdateUpdatePOWER AND COOLINGCOOLING ENVCOOLING ENVOCP Core TenetsOCP Core TenetsCooling Environments Project Overview Cooling Environments Project Overview SteeringSteeringImmersion workstream would like to invite the community to join our open calls:adoption hurdles new technologie

3、sGenerating new workstreamsCold plate is looking for people with experience related to Coolant fluids:OEMODMEnd UserXFN Fluid workstreams across CE:From component to TCS Loop From TCS to FWSMaterials compatibility/wetted materialThank You!Thank You!Steve Mills-META-Open Compute Steering Committee Me

4、mberPaul Artman-AMD Fellow Systems Design EngineerRoadmap for a Durable Chip Roadmap for a Durable Chip Coolant TemperatureCoolant TemperaturePOWER AND COOLINGCOOLING ENVCOOLING ENVAlignment of Industry Partners Continued engagement underway with other hyperscalers and silicon suppliersNvidiaEquinix

5、Power TrendsWhy Does DC Durability Matter?For every 4C degrees the coolant temperature is lowered below 30C,chiller operational hours increase 20%Data centers take 2-4 years to plan and build with a lifetime 15 yearsCoolant temperature below the coolant design temperature results in costly and time-

6、intensive retrofitsCall to ActionCall to ActionNext Steps for the group:Whitepaper covering the importance of 30C as a durable operating point for both DC operators and silicon designersHBM specification to provide longterm guidance to main