PROGRE~1.PDF

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1、Power,Thermal&Interconnect aspects of a revolutionary computing ArchitectureProgress toward an Open&Sustainable,Energy Centric Computing Architecture for todays AI&HPC ApplicationsAllan Cantle,CEO,Nallasway OCP HPC SubProject Technical Lead Progress toward an Open&Sustainable,Energy Centric Computin

2、g Architecture for todays AI&HPC ApplicationsSustainable Scalable Computational InfrastructureSERVEROCP High Performance Compute Module,HPCM,from HPC to the EdgeDetailed Overview:OCP Global Summit,2023:-https:/ Efficient Power DeliveryThermal Management Concept including Energy Re-use Universal Topo

3、logy Interconnect Summary&Call to ActionOverview48V Bus BarPower,Thermal&Interconnect Challenge of Todays AI Racks120KW RackFacility Power to 48V PSUFacility Power to 48V PSUPower Distribution UnitGrace-Blackwell Bring Up SystemGrace-Blackwell Production SystemGrace-Blackwell RackGrace-Blackwell NVL

4、ink SwitchFansPower Efficiency Copper Losses from Facility to Chip distance up to 2.5MComplex Hybrid Liquid+Air CoolingSignal Integrity-From PCB Traces to CablesComposable HPC with the OCP Wall Of Compute Frontier Super Computer FootprintA Sustainable,Energy Centric Computing,System ArchitectureFron

5、tier Concept,OCP Wall of Compute50,000 HPCMs,High Performance Compute Modules50,000 CPUs,GPUs&SwitchesComposable HPC with the OCP Wall Of Compute Frontier Super Computer FootprintA Sustainable,Energy Centric Computing,System ArchitectureFrontier Concept,OCP Wall of Compute50,000 HPCMs,High Performan

6、ce Compute Modules50,000 CPUs,GPUs&Switches50pJ/bit+1-2pJ/bitAIs insatiable need for Memory Bandwidth AND Capacity at low latencyComposable,Domain Specific Architecture building blockInspired by OAM,OCP Accelerator ModuleAny Processor,Accelerator,Switch 1KW16x E3.S Memory/Media Modules Direct Water